Solutions for AdvancedTCA, AdvancedTCA 300, MicroTCA, and AdvancedMC Standards
Advanced TCA高级电信计算体系结构PICMG开发了Micro Telecommunications Computing Architecture和Advanced MC开放式行业标准，在试图支持各种潜在的未来技术的同时，高度重视成本效益。
- 间距：0.06-4.5mm
- 孔位数：2-288孔
- 密封性：不防水
- 电流：0.02-30
- 额定电压：30-250V AC/DC
- 运行温度范围：-65℃~+125℃
- 符合RoHS
- 品牌：TE
1.0mm Free Height（FH）（IEEE 1386）Connectors
Zone 1 Power Connector
Z-PACK HM-Zd Connector
Z-PACK HS3 Connector
Co-Planar UPM
AdvancedTCA Guide Modules
Z-PACK SLIM UHD BACKPLANE CONNECTOR
Advanced Mezzanine Card Connectors
AdvancedTCA-Zone2 Z-Pack HM-Zd High Speed Signal Connectors
Low Profile RJ45 Modular Jacks
AdvancedTCA Front&Rear I/O Connectors MRJ21 Receptacles
MULTI-BEAM XL
Vertical AdvancedMC Connector for MicroTCA Applications
MINIPAK HD Power Connectors
AdvancedTCA- Front&Rear I/O Connectors-SFP Modules
AdvancedTCA — Front & Rear I/O Connectors – SFP Modules
Low Profile DDR2 Connector for AdvancedTCA Standards
SO DIMM Connectors for AdvancedMC Applications
Stacked RJ45 Modular Jacks For AdvancedTCA
Z-PACK TinMan Connectors
