应用:
On board equipment (ADAS-ECU, Central gateway, etc.), FA equipment, semiconductor manufacturing equipment, office machines, communication equipment, measuring equipment, broadcasting equipment and other various applications
Minimum Thickness of The Plating Contact Area:
0.1 micrometer min.
包装类型:
Embossed tape packaging
Existence of Polarization Key:
With Key
Existence of Location Boss:
With Boss
Finish of Hold-down:
Copper alloy/ Tin plating
堆叠高度:
8, 10, 14, 16, 18, 20, 22, 24, 30 mm
浮动范围:
X direction: +/-0.5 mm,Y direction: +/-0.5 mm